Patents/Inventors

Koji Kishino

FukushimaJP1 patent

2 Patents

US120210152024
Thermosetting Resin Composition, Metal-clad Laminated Plate, Insulating Sheet, Printed Wiring Board, Method of Manufacturing Printed Wiring Board, and Package Substrate
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., Ltd.
0 cites
US116383492023
Metal-clad Laminate and Printed Wiring Board
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., Ltd.
0 cites