Patents/Inventors

Koichiro Okamoto

OsakaJP4 patents

4 Patents

US125885482026
Resin Composition for Semiconductor Sealing, Underfill Material, Mold Resin, and Semiconductor Package
SEKISUI KASEI CO., Ltd.
0 cites
US124158952025
Hydrogel and Uses Therefor
SEKISUI KASEI CO., Ltd.
0 cites
US122847552025
Laminate, Laminate with Buildup Layer, Laminate with Metal Foil, and Circuit Board
SEKISUI KASEI CO., Ltd.
0 cites
US121274852024
Switching Element and Method for Manufacturing Same
NANOBRIDGE SEMICONDUCTOR, Inc.
0 cites