Patents/Inventors

Koichi Saito

TokyoJP18 patents

19 Patents

US123783762025
Optically Softening Resin Composition, Method for Producing Softened Product of Optically Softening Resin Composition, Curable Resin Composition and Cured Product of Same, and Patterned Film and Method for Producing Same
RESONAC CORPORATION
0 cites
US123197492025
Antibody and Functional Fragment Thereof
SUMITOMO CHEMICAL COMPANY, LIMITED
0 cites
US123116372025
Laminated Glazing Assembly Including an Antenna Assembly
AGC Automotive Americas Co.
0 cites
US120307582024
Initial Setting Method for Unmanned Forklift
Mitsubishi Logisnext Co., Ltd.
0 cites
US120102802024
Machine Learning Device, Machine Learning Method, and Machine Learning Program
KONICA MINOLTA, Inc.
0 cites
US119602722024
Production Line Monitoring System
SEIKO EPSON CORPORATION
0 cites
US118902962024
Anti-tumor Agent Containing Cytarabine, Anti- Tumor Effect Enhancing Agent Which Is Used in Combination with Cytarabine, Anti-tumor Kit, and Anti-tumor Agent Which Is Used in Combination with Cytarabine
FUJIFILM Corporation
0 cites
US118840122024
Three-dimensional Shaping Device and Method of Shaping Three-dimensional Shaped Article
SEIKO EPSON CORPORATION
0 cites
US118877722024
Surface Mount Inductor
Murata Manufacturing Co., Ltd.
0 cites
US118077042023
Functionalized Polymer, Process for Preparing and Rubber Compositions Containing the Functionalized Polymer
Bridgestone Corporation
0 cites
US117871112023
Shaping Material Supply Device and Three-dimensional Shaping Apparatus
SEIKO EPSON CORPORATION
0 cites
US117801552023
Method for Manufacturing Three-dimensional Shaped Object and Three-dimensional Shaping Apparatus
SEIKO EPSON CORPORATION
0 cites
US117425632023
Backdoor and Rear Glass
AGC Inc.
0 cites
US117180422023
Three-dimensional Modeling Apparatus and Method for Controlling Three-dimensional Modeling Apparatus
SEIKO EPSON CORPORATION
0 cites
US117018372023
Three-dimensional Shaping Apparatus and Control Method for Three-dimensional Shaping Apparatus
SEIKO EPSON CORPORATION
0 cites
US116971592023
Three-dimensional Shaping Device and Method for Manufacturing Three-dimensional Shaped Object
SEIKO EPSON CORPORATION
0 cites
US116913402023
Three-dimensional Modeling Apparatus and Three-dimensional Modeling Method
SEIKO EPSON CORPORATION
0 cites
US115482312023
Three-dimensional Modeling Apparatus and Method for Controlling Three-dimensional Modeling Apparatus
SEIKO EPSON CORPORATION
0 cites
US115488782023
Emopamil Binding Protein Binding Agent and Use Thereof
FUJIFILM Toyama Chemical Co., Ltd.
0 cites