Patents/Inventors

Koichi Ozaki

OkayamaJP3 patents

4 Patents

US123114372025
Thixomolding Material
SEIKO EPSON CORPORATION
0 cites
US118783452024
Thixomolding Material
SEIKO EPSON CORPORATION
0 cites
US118656092024
Method for Manufacturing Powder-modified Magnesium Alloy Chip
Seiko Epson Corporation
0 cites
US115480662023
Injection Molding Material for Magnesium Thixomolding
Seiko Epson Corporation
0 cites