4 Patents
- US124513972025Semiconductor Wafer and Method for Manufacturing Semiconductor Device
Mitsubishi Electric Corporation
0 cites - US123548622025Method for Analyzing Metal Microparticles, and Inductively Coupled Plasma Mass Spectrometry Method
IAS, Inc
0 cites - US118815162024Semiconductor Element Comprising a MIM Capacitor and a via Hole, a Bottom of the via Hole Being Placed Between a Rear Surface of a Source Electrode and a Rear Surface of a Barrier Metal Layer
Mitsubishi Electric Corporation
0 cites - US115690812023Method for Analyzing Metal Fine Particles, and Inductively Coupled Plasma Mass Spectrometry Method
IAS Inc.
0 cites