Kohei Miki

3 Patents

• US122437392025

  Semiconductor Wafer and Method for Manufacturing Same

  Mitsubishi Electric Corporation

  0 cites
• US120421762024

  Puncturing Instrument and Puncturing Device

  TRANSELL Co., Ltd.

  0 cites
• US118815162024

  Semiconductor Element Comprising a MIM Capacitor and a via Hole, a Bottom of the via Hole Being Placed Between a Rear Surface of a Source Electrode and a Rear Surface of a Barrier Metal Layer

  Mitsubishi Electric Corporation

  0 cites