Patents/Inventors

Kiyotaka Nakaya

TokyoJP3 patents

4 Patents

US122268202025
Bonding Sheet
MITSUBISHI MATERIALS CORPORATION
0 cites
US117537332023
Method for Producing High-purity Electrolytic Copper
MITSUBISHI MATERIALS CORPORATION
0 cites
US116616672023
Anti-corrosion Terminal Material, Anti-corrosion Terminal and Electric Wire End Structure
MITSUBISHI MATERIALS CORPORATION
0 cites
US115726332023
Tin-plated Copper Terminal Material and Method of Manufacturing the Same
MITSUBISHI MATERIALS CORPORATION
0 cites