55 Patents
- US126220212026Semiconductor Structure with Conductive Spacer in Shallow Trench Isolation Region
International Business Machines Corporation
0 cites - US126158162026Flexible Self-aligned Power via Shape with Gate Cut First
International Business Machines Corporation
0 cites - US126158322026Self-aligned Backside Contact Structure for Semiconductor Device Power Delivery
International Business Machines Corporation
0 cites - US126160192026Via Connection to Backside Power Delivery Network
International Business Machines Corporation
0 cites - US126158412026Forksheet Transistor with Advanced Cell Height Scaling
International Business Machines Corporation
0 cites - US126044962026Epitaxy Everywhere Based Self-aligned Direct Backside Contact
International Business Machines Corporation
0 cites - US125989702026Top via on Subtractively Etched Conductive Line
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites - US125934682026Self-aligned Backside Contact with Increased Contact Area
International Business Machines Corporation
0 cites - US125882802026Backsides Subtractive M1 Patterning with Backside Contact Repair for Tight N2P Space
International Business Machines Corporation
0 cites - US125882652026Semiconductor Structure with Enhanced Placeholder Position Margin
International Business Machines Corporation
0 cites - US125686612026Self-aligned Backside Trench Epitaxy for Low Contact Resistivity
International Business Machines Corporation
0 cites - US125688142026Buried Power Rail Directly Contacting Backside Power Delivery Network
International Business Machines Corporation
0 cites - US125573592026Self-aligned Backside Contact with Protruding Source/drain
International Business Machines Corporation
0 cites - US125576262026Self-aligned Backside Contact with Deep Trench Last Flow
International Business Machines Corporation
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- US125576352026Hybrid Power Rail Formation in Dielectric Isolation for Semiconductor Device
International Business Machines Corporation
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- US125503512026Diffusion Break Between Passive Device and Logic Device with Backside Contact
International Business Machines Corporation
0 cites - US125503902026Trench Isolation for Backside Contact Formation
International Business Machines Corporation
0 cites - US125507122026Bulk Substrate Backside Power Rail0 cites
- US125507152026Heterogeneous Integration of Device Die Having BSPDN
International Business Machines Corporation
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- US125060802025Reduced Capacitance Between Power via Bar and Gates
INTERNATIONAL BUSINESS MACHINES CORPORATION
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- US124890352025Semiconductor Passive Device Integration for Silicon-on-insulator Substrate
International Business Machines Corporation
0 cites - US124778192025Stacked FET with Extremely Small Cell Height
International Business Machines Corporation
0 cites - US124514312025Stacked Semiconductor Devices with Topside and Backside Interconnect Wiring
International Business Machines Corporation
0 cites - US124446532025Buried Power Rail at Tight Cell-to-cell Space
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites - US124380852025Via to Backside Power Rail Through Active Region
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites - US124190792025Field Effect Transistor with Backside Source/drain
International Business Machines Corporation
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- US123946602025Buried Power Rail After Replacement Metal Gate
International Business Machines Corporation
0 cites - US123006172025Self-aligned Buried Power Rail Cap for Semiconductor Devices
International Business Machines Corporation
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- US122680312025Backside Power Rails and Power Distribution Network for Density Scaling
International Business Machines Corporation
0 cites - US122666072025Bottom Barrier Free Interconnects Without Voids
International Business Machines Corporation
0 cites - US122439132025Self-aligned Backside Contact Integration for Transistors
International Business Machines Corporation
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- US120876912024Semiconductor Structures with Backside Gate Contacts
International Business Machines Corporation
0 cites - US119904102024Top via Interconnect Having a Line with a Reduced Bottom Dimension
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites - US119904122024Buried Power Rails Located in a Base Layer Including First, Second, and Third Etch Stop Layers
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites - US119729772024Fabrication of Rigid Close-pitch Interconnects
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites - US119617592024Interconnects Having Spacers for Improved Top via Critical Dimension and Overlay Tolerance
INTERNATIONAL BUSINESS MACHINES CORPORATION
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- US118429612023Advanced Metal Interconnects with a Replacement Metal
International Business Machines Corporation
0 cites - US118239982023Top via with Next Level Line Selective Growth
International Business Machines Corporation
0 cites - US118044062023Top via Cut Fill Process for Line Extension Reduction
International Business Machines Corporation
0 cites - US118044362023Self-aligned Buried Power Rail Cap for Semiconductor Devices
International Business Machines Corporation
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- US116705422023Stepped Top via for via Resistance Reduction
International Business Machines Corporation
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