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Inventors
Kimihiro Ashino
Matsumoto
JP
1 patent
2 Patents
US12165938
2024
Semiconductor Package, Resin Molded Product, and Method of Molding Resin Molded Product
FUJI ELECTRIC CO., Ltd.
0 cites
US11835415
2023
Physical Quantity Sensor Device Including Curved Through-hole
FUJI ELECTRIC CO., Ltd.
0 cites