Patents/Inventors

Kijoo Hong

Seongnam-siKR2 patents

3 Patents

US123680652025
Wafer Processing Apparatus
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US121112702024
Method of Inspecting a Wafer and Apparatus for Performing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116685582023
Thickness Estimation Method and Processing Control Method
SAMSUNG ELECTRONICS CO., Ltd.
0 cites