Patents/Inventors

Ki Tae Park

Santa Clara, CAUS23 patents

20 Patents

US126104582026
Flexible Printed Circuit Board, COF Module, and Electronic Device Comprising the Same
LG INNOTEK CO., Ltd.
0 cites
US125488512026
Separator Coating Materials for Rechargeable Batteries
Rivian IP Holdings, LLC
0 cites
US125371892026
Systems and Methods for Adhesion of Electrodes
Rivian IP Holdings, LLC
0 cites
US124944712025
Mechanical Stripping of Sacrificial Layer
Enovix Corporation
0 cites
US124790062025
Electronic Device and Method for Operating Resonator Element at Resonance Frequency
IRON DEVICE CORPORATION
0 cites
US124315972025
Battery Thermal Release Layer
Rivian IP Holdings, LLC
0 cites
US124246302025
M N+1 AX Carbide Additive Materials for Lithium-ion Batteries
Rivian IP Holdings, LLC
0 cites
US124249432025
Power Apparatus
IRON DEVICE CORPORATION
0 cites
US123880852025
Electrodes Comprising Blended Active Materials
Rivian IP Holdings, LLC
0 cites
US123288172025
Flexible Printed Circuit Board, COF Module, and Electronic Device Comprising the Same
LG INNOTEK CO., Ltd.
0 cites
US122341482025
Method of Preparing Lithium Metal Phosphate Cathode Materials
Rivian IP Holdings, LLC
0 cites
US122307972025
High Energy Density Olivine-based Cathode Materials
Rivian IP Holdings, LLC
0 cites
US121527152024
Chained Fireproof Sealing System
0 cites
US120627912024
Electrode Coatings and Components Thereof
Rivian IP Holdings, LLC
0 cites
US120398492024
Building Monitoring System for Sensing Fire on Every Fire Compartment in Real Time by Using Sensor Attached to Edge of Hole of Fire Wall
0 cites
US119732252024
Lithium Metal Phosphate Electrode Manufacturing
Rivian IP Holdings, LLC
0 cites
US119687792024
Flexible Printed Circuit Board, COF Module, and Electronic Device Comprising the Same
LG INNOTEK CO., Ltd.
0 cites
US119426422024
Electrolytes and Components Thereof
Rivian IP Holdings, LLC
0 cites
US117586592023
Flexible Printed Circuit Board, COF Module, and Electronic Device Comprising the Same
LG INNOTEK CO., Ltd.
0 cites
US117107152023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites