Patents/Inventors

Kevin Lin

Beaverton, ORUS26 patents

25 Patents

US124827442025
Subtractively Patterned Interconnect Structures for Integrated Circuits
Intel Corporation
0 cites
US123612212025
Grammar Transfer Using One or More Neural Networks
NVIDIA Corporation
0 cites
US122610572025
Textile Patterning for Subtractively-patterned Self-aligned Interconnects, Plugs, and Vias
Tahoe Research, Ltd.
0 cites
US122117942025
Integrated Circuits and Methods for Forming Thin Film Crystal Layers
Intel Corporation
0 cites
US121984202025
Adversarial Learning for Finegrained Image Search
Ebay Inc.
0 cites
US121762142024
Selective Metal Removal for Conductive Interconnects in Integrated Circuitry
Intel Corporation
0 cites
US121194092024
Multi-layer Crystalline Back Gated Thin Film Transistor
Intel Corporation
0 cites
US120564902024
Methods and Systems for Handling Control Flow Structures in Data-parallel Architectures
HUAWEI TECHNOLOGIES CO., Ltd.
0 cites
US120274582024
Subtractively Patterned Interconnect Structures for Integrated Circuits
Intel Corporation
0 cites
US118942702024
Grating Replication Using Helmets and Topographically-selective Deposition
Intel Corporation
0 cites
US118880342024
Transistors with Metal Chalcogenide Channel Materials
Intel Corporation
0 cites
US118548822023
Subtractive Plug and Tab Patterning with Photobuckets for Back End of Line (BEOL) Spacer-based Interconnects
Tahoe Research, Ltd.
0 cites
US118361792023
Multimedia Query System
Meta Platforms Technologies, LLC
0 cites
US118307682023
Integrated Circuits with Line Breaks and Line Bridges Within a Single Interconnect Level
Intel Corporation
0 cites
US118307882023
Integrated Circuits and Methods for Forming Integrated Circuits
Intel Corporation
0 cites
US117988382023
Capacitance Reduction for Semiconductor Devices Based on Wafer Bonding
Intel Corporation
0 cites
US117643062023
Multi-layer Crystalline Back Gated Thin Film Transistor
Intel Corporation
0 cites
US117157912023
Group Iii-nitride Devices on SOI Substrates Having a Compliant Layer
Intel Corporation
0 cites
US117106362023
Metal and Spacer Patterning for Pitch Division with Multiple Line Widths and Spaces
Intel Corporation
0 cites
US117053952023
Core Fill to Reduce Dishing and Metal Pillar Fill to Increase Metal Density of Interconnects
Intel Corporation
0 cites
US116642702023
Metal-insulator-metal (MIM) Structure Supporting High Voltage Applications and Low Voltage Applications
Intel Corporation
0 cites
US116455062023
Neural Network for Skeletons from Input Images
Microsoft Technology Licensing, LLC
0 cites
US116475112023
Methods for Inter-system Carrier Aggregation in Advanced Wireless Communication Systems
NEC CORPORATION
0 cites
US116055922023
Method to Fabricate Metal and Ferromagnetic Metal Multilayer Interconnect Line for Skin Effect Suppression
Intel Corporation
0 cites
US115575362023
Integrated Circuits (ic's) with Electro-migration (em)—resistant Segments in an Interconnect Level
Intel Corporation
0 cites