Patents/Inventors

Kevin Lai Lin

Beaverton, ORUS3 patents

3 Patents

US123343922025
Multi-height Interconnect Trenches for Resistance and Capacitance Optimization
0 cites
US116643052023
Staggered Lines for Interconnect Performance Improvement and Processes for Forming Such
Intel Corporation
0 cites
US116462662023
Helmet Structures for Semiconductor Interconnects
Intel Corporation
0 cites