19 Patents
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- US125818572026Integrated Thermoelectric Device to Mitigate Integrated Circuit Hot Spots
Intel Corporation
0 cites - US125060592025Vertically Spaced Intra-level Interconnect Line Metallization for Integrated Circuit Devices
Intel Corporation
0 cites - US124128382025Integrated Circuit Structure with Filled Recesses0 cites
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- US120027542024Multi-height and Multi-width Interconnect Line Metallization for Integrated Circuit Structures
Intel Corporation
0 cites - US119904032024Dielectric Helmet-based Approaches for Back End of Line (BEOL) Interconnect Fabrication and Structures Resulting Therefrom
Intel Corporation
0 cites - US119538262024Lined Photobucket Structure for Back End of Line (BEOL) Interconnect Formation
Intel Corporation
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- US119488742024Vertically Spaced Intra-level Interconnect Line Metallization for Integrated Circuit Devices
Intel Corporation
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- US117698142023Device Including Air Gapping of Gate Spacers and Other Dielectrics and Process for Providing Such
Intel Corporation
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