Patents/Inventors

Kevin J. Anderson

Plano, TXUS1 patent

2 Patents

US119293002024
Method for Packaging an Integrated Circuit (IC) Package with Embedded Heat Spreader in a Redistribution Layer (RDL)
Qorvo US, Inc.
0 cites
US116263402023
Integrated Circuit (IC) Package with Embedded Heat Spreader in a Redistribution Layer (RDL)
Qorvo US, Inc.
0 cites