Kevin H. Song

3 Patents

• US122576642025

  Controlling Chemical Mechanical Polishing Pad Stiffness by Adjusting Wetting in the Backing Layer

  Applied Materials, Inc.

  0 cites
• US120906002024

  Face-up Wafer Electrochemical Planarization Apparatus

  Applied Materials, Inc.

  0 cites
• US117243552023

  Substrate Polish Edge Uniformity Control with Secondary Fluid Dispense

  Applied Materials, Inc.

  0 cites