Patents/Inventors

Keunhyuk Lee

SuzhouCN18 patents

16 Patents

US125937362026
Power Module Package with Stacked Direct Bonded Metal Substrates
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
USD11137762026
Power Module Package
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US124890802025
Flexible Clip with Aligner Structure
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
USD10980552025
Power Module Package
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
USD10954742025
Power Module Package
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US123549302025
Module with Substrate Recess for Conductive-bonding Component
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US123006892025
Dual Cool Power Module with Stress Buffer Layer
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US122665902025
Dual Side Direct Cooling Semiconductor Package
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US122117712025
Power Module and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US121195762024
Press-fit Power Module and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US120741602024
Isolated 3D Semiconductor Device Package with Transistors Attached to Opposing Sides of Leadframe Sharing Leads
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US119088262024
Flexible Clip with Aligner Structure
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US117768712023
Module with Substrate Recess for Conductive-bonding Component
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US116581712023
Dual Cool Power Module with Stress Buffer Layer
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US116520302023
Power Module and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US116159672023
Power Module Package and Method of Manufacturing the Same
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites