Patents/Inventors

Keunho Choi

Suwon-siKR2 patents

4 Patents

US124531042025
Semiconductor Package and Method of Manufacturing the Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US118239952023
Package Substrate, and Semiconductor Package Including the Package Substrate
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US118240432023
Semiconductor Package
SAMSUNG ELECTRONICS CO, Ltd.
0 cites
US116263802023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites