Patents/Inventors

Keumhee Ma

Suwon-siKR4 patents

4 Patents

US125436032026
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US123158182025
Interconnection Structure of a Semiconductor Chip Having Pads of Different Widths and Semiconductor Package Including the Interconnection Structure
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116886672023
Semiconductor Package Including a Pad Pattern
Samsung Electronics Co., Ltd.
0 cites
US116263702023
Interconnection Structure of a Semiconductor Chip and Semiconductor Package Including the Interconnection Structure
SAMSUNG ELECTRONICS CO., Ltd.
0 cites