Patents/Inventors

Kenshiro Fukuda

AgeoJP1 patent

2 Patents

US123516982025
Resin Composition, Copper Foil with Resin, Dielectric Layer, Copper-clad Laminate, Capacitor Element, and Printed Wiring Board with Built-in Capacitor
MITSUI MINING & SMELTING CO., Ltd.
0 cites
US122973542025
Resin Composition, Copper Foil with Resin, Dielectric Layer, Copper-clad Laminate, Capacitor Element, and Printed Wiring Board with Built-in Capacitor
MITSUI MINING & SMELTING CO., Ltd.
0 cites