19 Patents
- US125507082026Top via Interconnect with an Embedded Antifuse
International Business Machines Corporation
0 cites - US125387142026Magneto-resistive Random Access Memory with Laterally-recessed Free Layer
International Business Machines Corporation
0 cites - US125387852026Fully-aligned and Dielectric Damage-less Top via Interconnect Structure
International Business Machines Corporation
0 cites - US124380472025Double Patterning with Selectively Deposited Spacer
International Business Machines Corporation
0 cites - 0 cites
- US124009122025Dual-damascene Fav Interconnects with Dielectric Plug
International Business Machines Corporation
0 cites - US124023292025Top via Containing Random-access Memory Cross-bar Array
International Business Machines Corporation
0 cites - 0 cites
- US123411002025Copper Interconnects with Self-aligned Hourglass-shaped Metal Cap
International Business Machines Corporation
0 cites - 0 cites
- US122666072025Bottom Barrier Free Interconnects Without Voids
International Business Machines Corporation
0 cites - US120876242024Beol Tip-to-tip Shorting and Time Dependent Dielectric Breakdown
International Business Machines Corporation
0 cites - US120573952024Top via Interconnects Without Barrier Metal Between via and Above Line
International Business Machines Corporation
0 cites - US120274162024BEOL Etch Stop Layer Without Capacitance Penalty
International Business Machines Corporation
0 cites - US119729772024Fabrication of Rigid Close-pitch Interconnects
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites - 0 cites
- US118482642023Semiconductor Structure with Stacked Vias Having Dome-shaped Tips
International Business Machines Corporation
0 cites - US117588192023Magneto-resistive Random Access Memory with Laterally-recessed Free Layer
International Business Machines Corporation
0 cites - US117354752023Removal of Barrier and Liner Layers from a Bottom of a Via
International Business Machines Corporation
0 cites