Kenji Takeshita

2 Patents

• US123157322025

  Method and Apparatus for Etching a Semiconductor Substrate in a Plasma Etch Chamber

  Applied Materials, Inc.

  0 cites
• US122781102025

  Bias Voltage Modulation Approach for Sio/sin Layer Alternating Etch Process

  Applied Materials, Inc.

  0 cites