Kenji Ota

9 Patents

• US124546152025

  Curable Organopolysiloxane Composition, Thermally Conductive Member and Heat Dissipation Structure

  DOW TORAY CO., Ltd.

  0 cites
• US123557272025

  Communication Terminal Device, Communication Control Method, and Communication Control Program

  NIPPON TELEGRAPH AND TELEPHONE CORPORATION

  0 cites
• US120374602024

  Multi-component Type Thermally Conductive Silicone-gel Composition, Thermally Conductive Material and Heat-emission Structure

  DOW TORAY CO., Ltd.

  0 cites
• US118821222024

  Preparation Device, Preparation System, Preparation Method, and Preparation Program

  NIPPON TELEGRAPH AND TELEPHONE CORPORATION

  0 cites
• US117650472023

  Control Device, Control Method, and Control Program

  NIPPON TELEGRAPH AND TELEPHONE CORPORATION

  0 cites
• US116740402023

  Thermally-conductive Silicone Gel Composition, Thermally-conductive Member, and Heat Dissipation Structure

  DOW TORAY CO., Ltd.

  0 cites
• US116649042023

  Transmission Device and Method of Setting Transmission Parameter

  FUJITSU LIMITED

  0 cites
• US115782452023

  Thermally-conductive Silicone Gel Composition, Thermally-conductive Member, and Heat Dissipation Structure

  DOW TORAY CO., Ltd.

  0 cites
• US115490432023

  Multicomponent-curable Thermally-conductive Silicone Gel Composition, Thermally-conductive Member and Heat Dissipation Structure

  DOW TORAY CO., Ltd.

  0 cites