Patents/Inventors

Kenichi Tomioka

TokyoJP1 patent

2 Patents

US122584682025
Thermosetting Resin Composition, Prepreg, Resin-coated Metal Foil, Laminate, Printed Wiring Board, and Semiconductor Package
Resonac Corporation
0 cites
US116913892023
Resin Composition, Prepreg, Metal Foil with Resin, Laminate, Printed Wiring Board, and Method for Producing Resin Composition
RESONAC CORPORATION
0 cites