Patents/Inventors

Kengo Aoya

BeppuJP8 patents

9 Patents

US122726262025
Conductive Members Atop Semiconductor Packages
TEXAS INSTRUMENTS INCORPORATED
0 cites
US121548612024
Frame Design in Embedded Die Package
TEXAS INSTRUMENTS INCORPORATED
0 cites
US121257992024
Embedded Die Packaging with Integrated Ceramic Substrate
TEXAS INSTRUMENTS INCORPORATED
0 cites
US120465422024
Heat-dissipating Wirebonded Members on Package Surfaces
TEXAS INSTRUMENTS INCORPORATED
0 cites
US120402602024
Electronic Package with Surface Contact Wire Extensions
TEXAS INSTRUMENTS INCORPORATED
0 cites
US119423842024
Semiconductor Package Having an Interdigitated Mold Arrangement
TEXAS INSTRUMENTS INCORPORATED
0 cites
US119233202024
Semiconductor Device Having Tapered Metal Coated Sidewalls
TEXAS INSTRUMENTS INCORPORATED
0 cites
US118482442023
Leaded Wafer Chip Scale Packages
Texas Instruments Incorporated
0 cites
US116010652023
Power Converter Module
TEXAS INSTRUMENTS INCORPORATED
0 cites