Patents/Inventors

Ken-yu Chang

HsinchuTW21 patents

20 Patents

US125882682026
Liner-free Conductive Structures
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US124330062025
Semiconductor Device with Conductive Liners Over Silicide Structures and Method of Making the Semiconductor Device
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US124008532025
Method of Forming Conductive Feature Including Cleaning Step
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US123621982025
Interface Tool and Methods of Operation
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123277882025
Gate to Source Drain Interconnects
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US123005392025
Source/drain Contact Formation Methods and Devices
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US122527832025
Chemical Vapor Deposition for Uniform Tungsten Growth
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122495662025
3DIC with Gap-fill Structures and the Method of Manufacturing the Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US121911992025
Contact Metallization Process
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US121486592024
Contact Conductive Feature Formation and Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120573972024
Capping Layer for Liner-free Conductive Structures
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120209812024
Conductive Feature Formation and Structure
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US119553292024
Method of Forming Conductive Feature Including Cleaning Step
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US119293142024
Interconnect Structures Including a Fin Structure and a Metal Cap
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118173842023
Interconnect Structure and Manufacturing Method for the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites
US117988432023
Conductive Feature Formation and Structure
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US117422402023
Source/drain Contact Formation Methods and Devices
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US116768592023
Contact Conductive Feature Formation and Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US116704992023
Method of Forming Conductive Feature Including Cleaning Step
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US115946092023
Liner-free Conductive Structures
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites