Patents/Inventors

Ken Ota

KanagawaJP1 patent

2 Patents

US120877162024
Techniques for Positioning Bond Pads of Microelectronic Devices and Related Microelectronic Devices, Methods, and Systems
Micron Technology, Inc.
0 cites
US120400122024
Semiconductor Device Having Buffer Circuit
Micron Technology, Inc.
0 cites