Patents/Inventors

Kemao Lin

SingaporeSG2 patents

2 Patents

US125060502025
Face Bonded Semiconductor Device with Through Oxide via and Metal Plug
Globalfoundries Singapore Pte. Ltd.
0 cites
US125001192025
Air Gap with Inverted T-shaped Lower Portion Extending Through at Least One Metal Layer, and Related Method
Globalfoundries Singapore Pte. Ltd.
0 cites