Kemal Aygün

6 Patents

• US125885242026

  Stacked via Modulator in High Speed Interconnect

  Intel Corporation

  0 cites
• US121487442024

  Optical Multichip Package with Multiple System-on-chip Dies

  Intel Corporation

  0 cites
• US121257772024

  Minimizing Package Impedance Discontinuity Through Dielectric Structure Optimizations

  Intel Corporation

  0 cites
• US120093202024

  Interconnect Loss of High Density Package with Magnetic Material

  Intel Corporation

  0 cites
• US119831352024

  Electrical and Optical Interfaces at Different Heights Along an Edge of a Package to Increase Bandwidth Along the Edge

  Intel Corporation

  0 cites
• US115748622023

  Optimal Signal Routing Performance Through Dielectric Material Configuration Designs in Package Substrate

  Intel Corporation

  0 cites