Patents/Inventors

Kemal Aygun

Tempe, AZUS30 patents

22 Patents

US126222942026
Methods and Apparatus to Improve Signal Integrity Performance in Integrated Circuit Packages
Intel Corporation
0 cites
US125388232026
Power Delivery for Embedded Bridge Die Utilizing Trench Structures
Intel Corporation
0 cites
US124827332025
Ground via Clustering for Crosstalk Mitigation
Intel Corporation
0 cites
US124130012025
Heterogenous Socket Contact for Electrical and Mechanical Performance Scaling in a Microelectronic Package
Intel Corporation
0 cites
US123477882025
Glass Substrates Having Signal Shielding for Use with Semiconductor Packages and Related Methods
Intel Corporation
0 cites
US123138902025
Through-substrate Optical Vias
Intel Corporation
0 cites
US120626162024
Power Delivery for Embedded Bridge Die Utilizing Trench Structures
Intel Corporation
0 cites
US120574132024
Package Design Scheme for Enabling High-speed Low-loss Signaling and Mitigation of Manufacturing Risk and Cost
Intel Corporation
0 cites
US119233082024
Die Interconnect Structures Having Bump Field and Ground Plane
Intel Corporation
0 cites
US119031382024
Fine Feature Formation Techniques for Printed Circuit Boards
Intel Corporation
0 cites
US119012802024
Ground via Clustering for Crosstalk Mitigation
Intel Corporation
0 cites
US118879322024
Dielectric-filled Trench Isolation of Vias
Intel Corporation
0 cites
US118375492023
Power Delivery for Embedded Bridge Die Utilizing Trench Structures
Intel Corporation
0 cites
US118173912023
Power Delivery for Embedded Bridge Die Utilizing Trench Structures
Intel Corporation
0 cites
US118108592023
Multi-layered Adhesion Promotion Films
Intel Corporation
0 cites
US117422752023
Ground via Clustering for Crosstalk Mitigation
Intel Corporation
0 cites
US117372272023
Selective Ground Flood Around Reduced Land Pad on Package Base Layer to Enable High Speed Land Grid Array (LGA) Socket
Intel Corporation
0 cites
US117158892023
Slow Wave Structure for Millimeter Wave Antennas
Intel Corporation
0 cites
US116949522023
Horizontal Pitch Translation Using Embedded Bridge Dies
Intel Corporation
0 cites
US116826132023
Package Substrates with Magnetic Build-up Layers
Intel Corporation
0 cites
US116212272023
Power Delivery for Embedded Bridge Die Utilizing Trench Structures
Intel Corporation
0 cites
US115454162023
Minimization of Insertion Loss Variation in Through-silicon Vias (tsvs)
Intel Corporation
0 cites