21 Patents
- US125819762026Wire Bonding Directly on Exposed Conductive Vias and Interconnects and Related Systems and Methods
Micron Technology, Inc.
0 cites - US125640962026Nested Semiconductor Assemblies and Methods for Making the Same
Micron Technology, Inc.
0 cites - US125327812026Stacked Capacitors for Semiconductor Devices and Associated Systems and Methods
Micron Technology, Inc.
0 cites - US124314182025Three Dimensional Semiconductor Trace Length Matching and Associated Systems and Methods
Micron Technology, Inc.
0 cites - US124328592025Surface Mount Device Bonded to an Inner Layer of a Multi-layer Substrate
Micron Technology, Inc.
0 cites - 0 cites
- US123746122025Microelectronic Device Packages and Related Methods and Systems
Micron Technology, Inc.
0 cites - US123622552025Apparatus Including Direct-contact Heat Paths and Methods of Manufacturing the Same
Micron Technology, Inc.
0 cites - 0 cites
- US123549392025Multi-role Semiconductor Device Substrates, Semiconductor Device Assemblies Employing the Same, and Methods for Forming the Same
Micron Technology, Inc.
0 cites - US122939922025Semiconductor Assemblies with Systems and Methods for Managing High Die Stack Structures
Micron Technology, Inc.
0 cites - US122438072025Substrates for Semiconductor Packages, Including Hybrid Substrates for Decoupling Capacitors, and Associated Devices, Systems, and Methods
Micron Technology, Inc.
0 cites - 0 cites
- US121487362024Three-dimensional Bonding Scheme and Associated Systems and Methods
Micron Technology, Inc.
0 cites - US119424602024Systems and Methods for Reducing the Size of a Semiconductor Assembly
Micron Technology, Inc.
0 cites - US119293512024Integrated Circuit Wire Bonded to a Multi-layer Substrate Having an Open Area That Exposes Wire Bond Pads at a Surface of the Inner Layer
Micron Technology, Inc.
0 cites - US118942892024Substrates for Semiconductor Packages, Including Hybrid Substrates for Decoupling Capacitors, and Associated Devices, Systems, and Methods
Micron Technology, Inc.
0 cites - US117231502023Surface Mount Device Bonded to an Inner Layer of a Multi-layer Substrate
Micron Technology, Inc.
0 cites - US117107222023Semiconductor Assemblies with Systems and Methods for Managing High Die Stack Structures
Micron Technology, Inc.
0 cites - US116886622023Thermal Distribution Network for Semiconductor Devices and Associated Systems and Methods
Micron Technology, Inc.
0 cites - 0 cites