Kelvin Aik Boo Tan

5 Patents

• US125937062026

  Multi-chip Package with Enhanced Conductive Layer Adhesion

  Micron Technology, Inc.

  0 cites
• US125885272026

  Dielectric Interposer with Electrical-connection Cut-in

  Micron Technology, Inc.

  0 cites
• US125001862025

  Capacitor Having Electrodes Formed Within a Substrate

  Micron Technology, Inc.

  0 cites
• US124762162025

  Wire Bonding for Stacked Memory Dies

  Micron Technology, Inc.

  0 cites
• US124631402025

  Flexible Interposer for Semiconductor Dies

  Micron Technology, Inc.

  0 cites