Patents/Inventors

Keita Yagi

TokyoJP10 patents

11 Patents

US124966772025
Polishing Apparatus and Polishing Method
EBARA CORPORATION
0 cites
US124293272025
Method of Producing a Model for Estimating Film Thickness of Workpiece, Method of Estimating Film Thickness of Workpiece Using Such a Model, and Computer Readable Storage Medium Storing Program for Causing Computer to Perform the Methods
EBARA CORPORATION
0 cites
US124203782025
Substrate Processing Apparatus and Method for Controlling Dressing of Polishing Member
EBARA CORPORATION
0 cites
US123875842025
Monitoring System, Monitoring Method, and Program
Bsize Inc.
0 cites
US120625632024
Substrate Processing Apparatus, Substrate Processing System, and Substrate Processing Method
EBARA CORPORATION
0 cites
USD10287552024
Tracking Device
BSIZE Inc.
0 cites
US119549922024
Monitoring System, Monitoring Method, and Program
BSIZE Inc.
0 cites
US119450752024
Polishing Apparatus and Polishing Member Dressing Method
EBARA CORPORATION
0 cites
US118839222024
Substrate Processing Apparatus
EBARA CORPORATION
0 cites
US118336362023
Substrate Polishing Apparatus, Method of Creating Thickness Map, and Method of Polishing a Substrate
EBARA CORPORATION
0 cites
US117599132023
Polishing Method and Polishing Apparatus
EBARA CORPORATION
0 cites