Keisuke Niida

8 Patents

• US125884742026

  Composition for Forming Protective Film Against Alkaline Aqueous Hydrogen Peroxide, Substrate for Producing Semiconductor Apparatus, Method for Forming Protective Film, and Method for Forming Pattern

  SHIN-ETSU CHEMICAL CO., Ltd.

  0 cites
• US123325672025

  Composition for Forming Silicon-containing Resist Underlayer Film, Patterning Process, and Silicon Compound

  SHIN-ETSU CHEMICAL CO., Ltd.

  0 cites
• US121054202024

  Coating-type Composition for Forming Organic Film, Patterning Process, Polymer, and Method for Manufacturing Polymer

  SHIN-ETSU CHEMICAL CO., Ltd.

  0 cites
• US118861182024

  Material for Forming Organic Film, Substrate for Manufacturing Semiconductor Device, Method for Forming Organic Film, Patterning Process, and Compound for Forming Organic Film

  SHIN-ETSU CHEMICAL CO., Ltd.

  0 cites
• US118515302023

  Material for Forming Organic Film, Patterning Process, and Polymer

  SHIN-ETSU CHEMICAL CO., Ltd.

  0 cites
• US116920662023

  Material for Forming Organic Film, Substrate for Manufacturing Semiconductor Device, Method for Forming Organic Film, Patterning Process, and Compound for Forming Organic Film

  SHIN-ETSU CHEMICAL CO., Ltd.

  0 cites
• US116768142023

  Material for Forming Organic Film, Substrate for Manufacturing Semiconductor Apparatus, Method for Forming Organic Film, and Patterning Process

  SHIN-ETSU CHEMICAL CO., Ltd.

  0 cites
• US116356912023

  Composition for Forming Organic Film, Substrate for Manufacturing Semiconductor Device, Method for Forming Organic Film, Patterning Process, and Polymer

  SHIN-ETSU CHEMICAL CO., Ltd.

  0 cites