3 Patents
- US123424672025Microstructure-transfer Apparatus, Stamp Head Unit, Stamp Component for Transferring Microstructure, and Method for Transferring Microstructure-integrated Component
SHIN-ETSU CHEMICAL CO., Ltd.
0 cites - US118627542024Method for Fabricating (LED) Dice Using Semiconductor Structures on a Substrate and Laser Lift-off to a Receiving Plate
Shin-etsu Chemical Co., Ltd.
0 cites - US118627552024Method for Fabricating (LED) Dice Using Laser Lift-off from a Substrate to a Receiving Plate
Shin-etsu Chemical Co., Ltd.
0 cites