Ke Yan Tean

7 Patents

• US120947932024

  Package with Electrically Insulated Carrier and at Least One Step on Encapsulant

  Infineon Technologies AG

  0 cites
• US120573762024

  Three Level Interconnect Clip

  Infineon Technologies AG

  0 cites
• US118760282024

  Package with Electrically Insulated Carrier and at Least One Step on Encapsulant

  Infineon Technologies AG

  0 cites
• US118044242023

  Method for Fabricating a Semiconductor Device by Using Different Connection Methods for the Semiconductor Die and the Clip

  Infineon Technologies Austria AG

  0 cites
• US116520782023

  High Voltage Semiconductor Package with Pin Fit Leads

  Infineon Technologies AG

  0 cites
• US116212042023

  Molded Semiconductor Module Having a Mold Step for Increasing Creepage Distance

  Infineon Technologies AG

  0 cites
• US116005472023

  Semiconductor Package with Expanded Heat Spreader

  Infineon Technologies Austria AG

  0 cites