4 Patents
- 0 cites
- US122407512025Sensor Package Substrate, Sensor Module Having the Same, and Sensor Package Substrate Manufacturing Method
TDK Corporation
0 cites - US121257542024Sensor Package Substrate, Sensor Module Including the Same, and Electronic Component Embedded Substrate
TDK CORPORATION
0 cites - US116826282023Semiconductor Ic-embedded Substrate Having Heat Dissipation Structure and Its Manufacturing Method
TDK CORPORATION
0 cites