Patents/Inventors

Kazuma Sekiya

TokyoJP24 patents

20 Patents

US125387622026
Processing Method of Bonded Wafer
DISCO CORPORATION
0 cites
US124244782025
Apparatus for and Method of Processing Workpiece
DISCO CORPORATION
0 cites
US123745352025
Wafer Processing Apparatus and Wafer Processing Method
DISCO CORPORATION
0 cites
US123507882025
Dressing Member
DISCO CORPORATION
0 cites
US123302662025
Polishing Apparatus with Thickness Measuring Unit
DISCO CORPORATION
0 cites
US123040272025
Grinding Apparatus and Use Method of Grinding Apparatus
DISCO CORPORATION
0 cites
US122179662025
Processing Method of Wafer, Protective Sheet, and Protective Sheet Laying Method
DISCO CORPORATION
0 cites
US122117312025
Wafer Processing Method
DISCO CORPORATION
0 cites
US121341382024
Wafer Manufacturing Method
DISCO CORPORATION
0 cites
US121192302024
Wet Etching Method and Wet Etching System
DISCO CORPORATION
0 cites
US120875892024
Method of Manufacturing Wafer and Method of Manufacturing Stacked Device Chip
DISCO CORPORATION
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US120805642024
Package Substrate Processing Method
DISCO CORPORATION
0 cites
US120402142024
Processing Apparatus Including a Cassette Mounting Section, a Reading Section, and an Information Transmitting Section Transmitting Information on Progress of Process Steps to Customer That Has Ordered the Processing of Each Workpiece
DISCO CORPORATION
0 cites
US120173142024
Fixed Temperature Liquid Supply Apparatus
DISCO CORPORATION
0 cites
US120117842024
Wafer, Wafer Manufacturing Method, Device Chip Manufacturing Method, and Resistivity Markings
DISCO CORPORATION
0 cites
US118580902024
Grinding Apparatus and Method of Driving Grinding Apparatus
DISCO CORPORATION
0 cites
US118506962023
Dressing Board, Use Method of Dressing Board, and Cutting Apparatus
DISCO CORPORATION
0 cites
US117384222023
Management Method of Machining System
DISCO CORPORATION
0 cites
US116519782023
Protective Sheet Application Apparatus and Method
DISCO CORPORATION
0 cites
US115481262023
Screwdriver
DISCO CORPORATION
0 cites