18 Patents
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- US121548772024Semiconductor Wafer and Method of Ball Drop on Thin Wafer with Edge Support Ring
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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- US120250142024Pit Initiation Evaluation System, And, Pit Initiation Evaluation Method
TOSHIBA ENERGY SYSTEMS & SOLUTIONS CORPORATION
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- US116836102023Photoelectric Converter, Photoelectric Conversion System, Moving Body, and Semiconductor Substrate
Canon Kabushiki Kaisha
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