Patents/Inventors

Kazuhiko Kuranobu

OgakiJP4 patents

4 Patents

US120339272024
Method for Manufacturing Wiring Substrate
IBIDEN CO., Ltd.
0 cites
US119358222024
Wiring Substrate Having Metal Post Offset from Conductor Pad and Method for Manufacturing Wiring Substrate
IBIDEN CO., Ltd.
0 cites
US117494442023
Inductor Built-in Substrate
IBIDEN CO., Ltd.
0 cites
US116224462023
Wiring Substrate
IBIDEN CO., Ltd.
0 cites