Kay Stefan Essig

7 Patents

• US120093172024

  Semiconductor Package Structure and Method for Manufacturing the Same

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US118814482024

  Semiconductor Package Structure Having Substrate with Embedded Electronic Component and Conductive Pillars

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US117912452023

  Electronic Package and Method for Manufacturing the Same

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US117054012023

  Semiconductor Package Structure and Method for Manufacturing the Same

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US116826562023

  Semiconductor Device Package and Method for Manufacturing the Same

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US115748562023

  Semiconductor Package

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US115454062023

  Substrate Structure, Semiconductor Package Structure and Method for Manufacturing a Substrate Structure

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites