Patents/Inventors

Katsushi Miki

YaoJP3 patents

4 Patents

US121396222024
Hollow Resin Particles for Thermosensitive Recording Media
MATSUMOTO YUSHI-SEIYAKU CO., Ltd.
0 cites
US119808632024
Heat-expandable Microspheres and Application Thereof
MATSUMOTO YUSHI-SEIYAKU CO., Ltd.
0 cites
US117732372023
Resin Composition, Molded Article and Heat-expandable Microspheres
MATSUMOTO YUSHI-SEIYAKU CO., Ltd.
0 cites
US117462052023
Heat-expandable Microspheres and Applications Thereof
MATSUMOTO YUSHI-SEIYAKU CO., Ltd.
0 cites