Karumbu Meyyappan

6 Patents

• US125060832025

  Liquid Metal Interconnect for Modular Package Server Architecture

  Intel Corporation

  0 cites
• US124944352025

  Liquid Metal Interconnect for Modular System on an Interposer Server Architecture

  Intel Corporation

  0 cites
• US124112962025

  Reworkable Zero-force Insertion Electrical Optical Package Socket and Method

  Intel Corporation

  0 cites
• US123493032025

  Low Force Liquid Metal Interconnect Solutions

  Intel Corporation

  0 cites
• US116224662023

  Low Force Liquid Metal Interconnect Solutions

  Intel Corporation

  0 cites
• US115434542023

  Double-beam Test Probe

  Intel Corporation

  0 cites