Kar Weng Yan

3 Patents

• US119553472024

  Encapsulation Process for Double-sided Cooled Packages

  ASMPT SINGAPORE PTE. Ltd.

  0 cites
• US116769372023

  Flexible Sinter Tool for Bonding Semiconductor Devices

  ASMPT SINGAPORE PTE. Ltd.

  0 cites
• US116211812023

  Dual-sided Molding for Encapsulating Electronic Devices

  ASMPT SINGAPORE PTE. Ltd.

  0 cites