Kao-feng Liao

8 Patents

• US123590902025

  Composition and Method for Polishing and Integrated Circuit

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.

  0 cites
• US123277342025

  Chemical Mechanical Polish Slurry and Method of Manufacture

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US122973752025

  Slurry Composition and Method for Polishing and Integrated Circuit

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.

  0 cites
• US123005082025

  Chemical Mechanical Polishing Method

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.

  0 cites
• US122495422025

  Semiconductor Device Structure with an Interconnect Structure in a Dielectric Layer with Multiple Hydrophobic Layers Along Sidewalls of the Dielectric Layer, and Method for Forming the Same

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US121722632024

  Chemical Mechanical Planarization Tool

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US118548722023

  Semiconductor Device Structure with Interconnect Structure and Method for Forming the Same

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US116794692023

  Chemical Mechanical Planarization Tool

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites