Patents/Inventors

Kang Hun Kim

Icheon-siKR3 patents

4 Patents

US124514672025
Semiconductor Device Having a Redistribution Bonding Interconnection, a Method of Manufacturing the Semiconductor Device, and a Chip Stack Package Including the Semiconductor Device
SK Hynix Inc.
0 cites
US122887612025
Semiconductor Device Including Re-distribution Pads Disposed at Different Levels and a Method of Manufacturing the Same
SK Hynix Inc.
0 cites
US122372512025
Semiconductor Package Including Connection Pad Including Groove Pattern
SK Hynix Inc.
0 cites
US120027832024
Methods of Manufacturing Semiconductor Device with Bump Interconnection
SK Hynix Inc.
0 cites