8 Patents
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- US124432522025Heat Transfer Enhancement for Three-dimensional Integrated Circuit Chips
Kambix Innovations, LLC
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- US122939572025Optimization of the Thermal Performance of the 3D Ics Utilizing the Integrated Chip-size Double-layer or Multi-layer Microchannels
Kambix Innovations II, LLC
0 cites - US120876632024Optimization of the Thermal Performance of the 3D Ics Utilizing the Integrated Chip-size Double-layer or Multi-layer Microchannels
Kambix Innovations, LLC
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