Patents/Inventors

Kai-ming Yang

TaoyuanTW18 patents

18 Patents

US125045912025
Co-packaged Structure for Optics and Electrics
UNIMICRON TECHNOLOGY Corp.
0 cites
US124380602025
Chip Package and Method of Manufacturing the Same
Unimicron Technology Corp.
0 cites
US124142432025
Manufacturing Method of Package Structure
Unimicron Technology Corp.
0 cites
US123692502025
Circuit Board Structure and Manufacturing Method Thereof
Unimicron Technology Corp.
0 cites
US122666162025
Integrated Circuit Package Structure
Unimicron Technology Corp.
0 cites
US122552792025
Light-emitting Diode Package Structure and Manufacturing Method Thereof
Unimicron Technology Corp.
0 cites
US122180172025
Glass Carrier Having Protection Structure and Manufacturing Method Thereof
UNIMICRON TECHNOLOGY Corp.
0 cites
US121609532024
Circuit Board Structure and Manufacturing Method Thereof
Unimicron Technology Corp.
0 cites
US119438772024
Circuit Board Structure and Manufacturing Method Thereof
Unimicron Technology Corp.
0 cites
US118957802024
Manufacturing Method of Package Structure
Unimicron Technology Corp.
0 cites
US118240122023
Integrated Circuit Package Structure and Method of Manufacturing the Same
Unimicron Technology Corp.
0 cites
US117641202023
Chip Packaging Structure and Manufacturing Method Thereof
Unimicron Technology Corp.
0 cites
US117643442023
Package Structure and Manufacturing Method Thereof
Unimicron Technology Corp.
0 cites
US117106902023
Package Structure and Manufacturing Method Thereof
Unimicron Technology Corp.
0 cites
US116826122023
Package Structure and Manufacturing Method Thereof
Unimicron Technology Corp.
0 cites
US116826582023
Light-emitting Package and Method of Manufacturing the Same
Unimicron Technology Corp.
0 cites
US116658322023
Circuit Board Structure and Manufacturing Method Thereof
Unimicron Technology Corp.
0 cites
US116370472023
Manufacturing Method of Chip Package Structure
Unimicron Technology Corp.
0 cites