Kai-ming Chiang

6 Patents

• US125123842025

  Semiconductor Package with Electrically Conductive Structure and Manufacturing Method Thereof

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US125124192025

  Method of Fabricating Memory Device and Package Structure

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US124380072025

  Staggered Metal Mesh on Backside of Device Die and Method Forming Same

  Taiwan Semiconductor Manufacturing Co., Ltd.

  0 cites
• US123344242025

  Package Structure and Manufacturing Method Thereof

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US122180822025

  Package Structure

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US118550062023

  Memory Device, Package Structure and Fabricating Method Thereof

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites