Patents/Inventors

Kai-kuang Ho

HsinchuTW3 patents

4 Patents

US124827772025
Copper Pillar Bump Structure and Method of Manufacturing the Same
UNITED MICROELECTRONICS Corp.
0 cites
US124179852025
Semiconductor Device and Method for Fabricating the Same
UNITED MICROELECTRONICS Corp.
0 cites
US123879982025
QFN Package and Fabricating Method of the Same
UNITED MICROELECTRONICS Corp.
0 cites
US118486602023
Surface Acoustic Wave Device Fabrication Method
UNITED MICROELECTRONICS Corp.
0 cites